

Practice S2.3 The metallic model with authentic IB Chemistry exam questions for both SL and HL students. This question bank mirrors Paper 1A, 1B, 2 structure, covering key topics like atomic structure, chemical reactions, and organic chemistry. Get instant solutions, detailed explanations, and build exam confidence with questions in the style of IB examiners.
Electrical and thermal conductivity depend on the mobility of electrons in metals.
Explain why transition metals are generally better conductors than alkali metals.
Compare the electrical conductivity of , , and , and justify your order.
Suggest one use of a highly conductive transition metal and explain why it is suitable.
Lithium, sodium, and potassium are Group 1 metals.
State the trend in melting point down Group 1.
Suggest how the number of delocalized electrons compares in these metals.
Explain the trend in melting point based on bonding.
Iron and potassium are both metallic elements, but their physical properties differ greatly.
State the type of bonding present in metallic elements.
Compare the number of delocalized electrons per atom in Fe and K.
Explain why iron has a higher melting point than potassium.
Sodium is a good conductor of electricity.
State the type of bonding present in metallic sodium.
Identify the particles responsible for electrical conductivity.
Explain how this bonding allows metals to conduct electricity.
Metals like copper can be drawn into wires.
Define the term ductility.
Explain why metallic bonding allows ductility.
Identify one additional property important for wire applications. Justify your choice.
Group 2 metals such as beryllium, magnesium, and calcium are used in structural alloys and electronics. Their physical properties, such as melting point, depend on the strength of their metallic bonding.
State the trend in atomic radius as you move down Group 2 from beryllium to calcium.
Describe how ionic charge and atomic radius affect the strength of metallic bonding in Group 2 elements.
Predict the correct order of melting points for beryllium, magnesium, and calcium.
Explain your prediction in terms of metallic bond strength and periodic trends.
Sodium, magnesium, and aluminium are in Period 3.
State how ionic charge changes across the period.
Compare their melting points.
Explain the trend using metallic bonding.
Aluminium is widely used in kitchen foil and drink cans.
Define malleability.
Explain why metallic bonding allows malleability.
Suggest one property of aluminium, besides malleability, that makes it useful in packaging.
A materials scientist is comparing two Group 1 and Group 2 metals, lithium and magnesium, for use in aerospace alloys. These metals differ in both density and metallic bonding strength.
Magnesium has a higher density than lithium. Using the metallic bonding model, explain this difference in terms of atomic structure and packing.
The table below shows data for the two metals:
| Metal | Atomic Radius (pm) | Relative Atomic Mass | Number of Delocalized Electrons |
|---|---|---|---|
| Lithium | 152 | 6.94 | 1 |
| Magnesium | 160 | 24.31 | 2 |
Using the data above, deduce which metal has stronger metallic bonding, and justify your answer.
Discuss why magnesium is more suitable than lithium in structural applications, despite being heavier.
Across Period 3, the metallic elements sodium (), magnesium (), and aluminum () show trends in atomic structure that influence their physical properties and bonding.
Describe the trend in atomic radius and nuclear charge for Na, Mg, and Al across Period 3.
Explain how the change in atomic radius and nuclear charge affects the strength of metallic bonding in these elements.
Using this information, describe the trend in melting points for Na, Mg, and Al, including the order.
Discuss how the number of delocalized electrons influences the metallic bond strength in this group.
Predict and explain how the electrical conductivity of these metals varies across the period.
Aluminum is widely used in aerospace due to its strength-to-weight ratio. Explain why understanding its metallic bonding is important in this application.